1  - EVG®805 Semi-automated Debonding System 

The EVG805 is a semi-automated system for debonding thin wafers from sapphire, quartz or silicon carriers. Dependent from the intermediate material, various debond approaches are possible. As for waxes and thermo-plast materials a thermal-activated, mechanical slide-off is utilized. For UV-activated tapes, UV-exposure and wedge-off debond is utilized. The thin wafer can be unloaded on a single substrate carrier for save and reliable transport between tools. More info…..

2. EVG®850TB Automated Temporary Bonding System

The temporary bonding process includes the application of the intermediate material on the carrier wafer before assembly is done in a bond chamber.

The different types of intermediate materials, e.g. thermo-plast adhesives, waxes, resists or tapes require different technologies to apply them on the wafer.

For liquid materials like adhesives, waxes and resists, a spin coating process is used traditionally. The process usually includes spin coating followed by a bake step before the bonding takes place. As for dry film tapes, the tape will be laminated onto the substrate in a lamination station before the final bonding step with the device wafer takes place. More info….. 

3. EVG®850DB Automated Debonding System

After further process steps on the device wafer (temporary bonded on a carrier), which generally include back thinning, lithography, metallization, etching, through via processing, etc., the device wafer is subsequently debonded from the carrier substrate before unloading into the dedicated output format takes place. Dependent from the intermediate material, various debond and cleaning approaches are possible. As for waxes and thermo-plast materials a thermal-activated, mechanical slide-off is utilized. For UV-activated tapes, UV-exposure and wedge-off debond is utilized. All thinned substrates are safely processed within the EVG850DB by a special handling system More info….. 
 

4. EVG®820 Lamination System

The EVG820 Lamination Station is used for automated, stress-free lamination of any kind of dry adhesive film onto the carrier wafer. This unique lamination technology performs punching of the adhesive tape supplied on a roll, followed by alignment and lamination. The Material usually is a double-side adhesive tape, either thermal- or UV- release. With punching technology size and dimension of tape are freely selectable and independent from substrate

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