1. EVG®301 Semi-automated Single Wafer Cleaning System

The EVG301 Semi-automated Single Wafer Cleaning System employs one cleaning station, which cleans wafers using standard DI-water rinse as well as megasonic, brush and diluted chemicals as additional cleaning options. With manual loading and pre-alignment, the EVG301 is a versatile R&D type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG's wafer alignment and bonding systems to eliminate any particle prior to wafer bonding. Spinner chucks are available for different wafer and substrate sizes to allow easy setup for different processes. More info…..

2. EVG®320 Automated Single Wafer Cleaning System

The EVG320 Automated Single Wafer Cleaning System handles wafers and substrates automatically between the process stations. The robot handling system ensures pre-alignment and loading of the wafers automatically in a cassette-to-cassette or FOUP-to-FOUP operation. Besides Di-water rinse, configuration options include megasonic, brush and diluted chemicals cleaning. More info….. 

3. EVG®810LT LowTemp®  Plasma Activation System

The EVG810LT LowTemp Plasma Activation System is a single chamber, stand-alone unit with manual operation. The process chamber allows for ex situ processes (wafers are activated one by one and bonded outside the plasma activation chamber). More info….. 

4. EVG®850 Automated Production Bonding System for SOI and Direct Wafer Bonding

SOI wafers are a promising new basic material for the microelectronics industry to produce faster and higher performance microelectronic devices. Wafer bonding, as one key enabling technology for the SOI wafer fabrication process, achieves high quality single crystal silicon films on insulating substrates. With the EVG850 SOI production bonding system, all essential steps for SOI bonding from cleaning and alignment to pre-bonding and IR-inspection are combined. Thus, the EVG850 assures a high-yield production process for void-free SOI wafers up to 300 mm sizes. Being the only production system built to operate in high-throughput, high-yield environments, the EVG850 has been established as the industry standard in the SOI wafer market. More info…..