1. GEMINI® Automated Production Wafer Bonding System

A maximum level of automation and process integration is achieved by the Gemini Automated Production Wafer Bonding System. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a big choice of process variations like anodic, silicon fusion, thermo-compression and eutectic bonding More info…. 
 
 
 
 

2. GEMINI®FB Automated Production Fusion Bonding System

GEMINI systems feature the fully automated way of bond alignment and bonding. The operator loads cassettes with unbonded wafers and picks up the finished substrates. Today's GEMINIs can be equipped with a variety of different pre-processing modules in order to fulfill customer requirements in a more flexible way. More info….