1- EVG®610 Semi-automated Bond Alignment System

The EVG610 Semi-automated Bond Alignment System is a flexible desktop unit targeted for R&D and small-scale production needs in MEMS/MST markets. The EVG610 contains a precision alignment stage for optical bond alignment. More info…. 

2- EVG®620 Automated Bond Alignment System

Known for its high level of automation and reliability, the EVG620 Bond Alignment System is designed for wafer-to-wafer alignment up to 150 mm wafer sizes.  The EV Group´s bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG´s bond alignment system accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications

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3-EVG®6200 Automated Bond Alignment System

The EVG bond alignment systems offer highest precision, flexibility, ease of use and modular upgrade capability and have been qualified in numerous high throughput production environments. The precision of EVG bond aligners accommodates most demanding alignment processes in MEMS production and in emerging fields like 3D integration applications.

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4- SmartView® Automated Bond Alignment System for Universal Alignment

The SmartView Automated Bond Alignment System for Universal Alignment offers a proprietary method for micron level face-to-face wafer level alignment. This alignment technique is key to achieving the required accuracy in multiple wafer stacking for leading edge technologies. SmartView technology can be combined with the Gemini wafer bonding systems for subsequent permanent bonding in a fully automated platform. 
 
 
 

5-SmartView®NT Automated Bond Alignment System for Universal Alignment 

The SmartView®NT Automated Bond Alignment System for Universal Alignment offers a proprietary method for micron level face-to-face wafer level alignment. This alignment technique is key to achieving the required accuracy in multiple wafer stacking for leading edge technologies. SmartView technology can be combined with the Gemini wafer bonding systems for subsequent permanent bonding in a fully automated platform. More info….