1- EVG®501 Wafer Bonding System

The EVG501 Wafer Bonding System is a highly flexible R&D system that can handle small substrate pieces up to 200 mm wafers. The new tool supports a variety of bonding 
processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder,and adhesive bonds, as well as other thermal processes, including oxide 
removal and high temperature bakes under a controlled atmosphere. The system also offers quick re-tooling with a conversion time of less than five 
minutes, making it ideal for universities and R&D as well as small-volume production applications More info….. 

2- EVG®510 Semi-automated Wafer Bonding System

The EVG510 Semi-automated Wafer Bonding System handles wafers up to 200mm and can easily be configured for research or production applications. The EVG510 system provides fully-automated processing with manual loading and unloading. The EVG510 features EV Group´s field proven uniform heating and pressure application systems. The modular bond chamber design for 150mm and 200mm wafers is recipe compatible with all higher EVG500 Series bonders as well as the GEMINI automated production wafer bonder. More info….. 

3- EVG®520IS Semi-automated Wafer Bonding System

The EVG520IS single-chamber unit handles wafers up to 200 mm with semi-automated operation for small volume production applications. Redesigned based on customer feedback and EV Group's continuous technological innovations, the EVG520IS features EV Group's proprietary symmetric rapid heating and cooling chuck design. Advantages such as independent top and bottom side heater, high pressure bonding capability and same material and process flexibility as on manual systems contribute to the success of all wafer bonding processes. More info….. 

4- EVG®540 Automated Wafer Bonding System

The EVG540 Automated Wafer Bonding System is an automated single-chamber production bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing in Wafer Level Packaging, 3D-Interconnect and MEMS applications. Based on modular design the EVG540 provides a proven solution for later transition of wafer bonding processes from R&D stage to large-scale manufacturing on our fully integrated production bonding systems. More info….. 
 
 
 
 
 
 
 
 

5- EVG®540C2W Automated Wafer & Chip-to-Wafer Bonding System 
 
 

The EVG540C2W is an automated chip-to-wafer bonder designed for pilot line and manufacturing as well as R&D for high volume manufacturing. Based on modular design the EVG540C2W provides a proven solution for later transition of wafer bonding processes from R&D stage to large-scale manufacturing on our fully integrated production bonding systems. More info….. 

6- EVG®560 Automated Wafer Bonding System

The EVG560 Automated Wafer Bonding System accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm. Based on the same bond chamber design and incorporating the key features of EVG's manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers. More info….

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