HERCULES®  Lithography Track System: 

The Hercules is a unique platform with spin coat, bake, chill, align/expose and develop modules, all arranged in one production system. It utilizes cassette-to-cassette handling systems to efficiently process wafers from 50 mm to 200 mm (or 200mm and 300 mm) in diameter. The Hercules safely handles thick, bowed or small diameter wafers. Precision top and front to backside alignment as well as coating of sub-micron to ultra-thick (up to 300 microns) resists can be applied for interlayer and passivation applications. The superior alignment stage design achieves highly accurate alignment and exposure results for high throughput. More info…….. 
 

More info:   à  http://www.evgroup.com/en/products/lithography/