1- EVG®101 Advanced Resist Processing System

The EVG101 series perform R&D type processes on a single chamber design, which is fully compatible with our automated systems. The EVG101 supports wafers up to 300 mm and can be configured for spin or spray coating and developing. Conformal layers of photoresist or polymers are achieved on 3D structured wafers for interconnection techniques with EVG's advanced OmniSpray^® coating technology. This ensures low material consumption of precious high-viscosity photoresists or polymers while improving uniformity and resist spreading options.

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2. EVG®101 Large Area Coating System

The EVG101 large area coating system is designed for panels. Compared to spin coating systems, it provides a cost-effective system for evaluation of new coating processes while saving up to 90% coating material by using EVG’s OmniSpray^® coating feature. More info… 

3-   EVG®105 Bake Module 

Softbake, post-exposure bake and hardbake processes can be performed. Controlled baking environment assures uniform evaporation. Programmable proximity pins provide the best available control of resist hardening processes and temperature profiles.

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4- EVG®120 Automated Resist Processing System 
 

The EVG120 is an economical tool for quality spin coating and develop processes, especially for standard photoresist applications. Combined spin coating, developing, and bake and chill processes give the EVG120 its high flexibility and provide for advanced multi-functional process variations. The system layout allows the processing of an extensive range of materials and delivers quality results for MEMS processes. It can integrate up to two spin modules and is fully-automated with a robot handling system that achieves cost-efficient, high throughput.

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5- EVG®150 Automated Resist Processing System up to 300mm 

 With up to four spin modules and a cassette-to-cassette handling system, the EVG150 allows for a fully-automated coat/develop process and high-thoroughput performance. Along with high spin speeds and coating chambers with closed lids, the EVG150 produces highly uniform coats and improves repeatability to suit these needs. Wafers with high topography can be uniformly coated by OmniSpray^® technology, where traditional spin coating encounters limitations.

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6- EVG®150 Automated NanoSpray Coating System 

This enhanced, patent pending spray coating technique is used for coating very small, but deep patterns. It is especially useful for coating vias with diameter of less than 200µm and aspect ratios of up to 1:4 and more. Side wall angle can be vertical. More info…