1. Wafer cleaning & drying

 

  

Modular equipment platforms for cleaning and drying.

RCA Clean 
State of the Art cleaning with pitch compressed processing and high throughput.  

ACD Advanced Clean Dry 
Compact three-bath equipment with proven exclusive HF/03 technology.

More Info……..

2. Silicon Wafer Etching

   

Process equipment of the latest generation - of outstanding uniformity results.

Etching 
Product family with modular and flexible designed equipment for etching silicon wafer.

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3. Wafer Drying

  
 

Drying technologies of the latest generation for high throughput.

Drying 
Drying technologies for all silicon wafer cleaning requirements.

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4. EPM – ElectroPlatingManual

   
 

Electrochemical deposition in manual system

Pure metal and alloy deposition as Au, Ag, Cu, Sn, Ni, SnAg for different applications in semiconductor and microsystem technologies. Enhanced liquid flow and electrical field control ensure a homogenous deposition at highest plating rates.

The plating tool operates manually and can be installed in R & D environments as well as in small production lines.

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5. WBM – Wet Bench Manual

  
 

Manual Wetbench for wetchemical processing

This flexible manually operated wetbench system can be used for various 
applications in semiconductor, microsystem and solar technologies. The modular 
design allows customised configurations according to your process requirements. 
The process modules are available in different materials eg. PP, PPs, PVDF, 
ECTFE, stainless steel or quartz

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6. EPA – ElectroPlatingAutomatic

   
 

Electrochemical deposition in an automatic system

Pure metal and alloy deposition as Au, Ag, Cu, Sn, Ni, SnAg for different applications in semiconductor and microsystem technologies. Enhanced liquid flow and electrical field control ensure a homogenous deposition at highest plating rates.

RENA offers customised solutions for special applications

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7.  Automation solutions

  

Adapted handling systems for best results and maximun productivity.

Wafer handling and transport 
Specially adapted automation and transfer system to ensure safe handling of the silicon wafers.

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8.  Analytics & Metrology

   

Measuring & classification 
Bath analysis 
Maximum quality standards in all wet process steps are assured through permanent monitoring of process baths.

Measuring & characterisation 
Devices for characterising wafer thickness, etching rates, surface roughness, damage, and other criteria can be integrated in RENA equipment for quality assurance and monitoring of material flow during wet process steps.

More Info…….. 
 
 

More Info à    http://www.rena.com/produkte/