1. Pegasus DRIE module

Pegasus represents a market leading Deep Reactive Ion Etch (DRIE) processing system, providing production customers the fastest etch rates with exacting feature profile control and excellent uniformity for substrate sizes up to 200mm, in applications requiring deep anisotropic etching. This combination of benefits further reduces the manufacturing cost in volume applications such as MEMS and Advanced Packaging concepts in silicon using STS’ ASE® processing technology. More info….

2. ICP module

With well over 500 modules installed, STS' ICP delivers a flexible, dependable plasma source capable of etching an extensive and varied range of materials. By simply changing the etch chemistry the chamber is utilized in etch applications from high aspect ratio Si features to low damage compound semiconductor applications - the chamber hardware remains the same More info…. 
 
 

3. APS module for dielectric etching

The APS, designed originally for deep etching of silicon dioxide, also proved to offer significant improvements compared to conventional RIE and ICP processing, for a wider range of materials such as lithium niobate, silicon carbide, and quartz.

Introduced at the end of 1999, as the Advanced Oxide Etch (AOE^TM) system, the APS is a revolutionary design based on STS' well-established Inductively Coupled Plasma (ICP) technology. The APS has aunique helical antenna arrangement.

More info….

4. PECVD  Plasma Enhanced Chemical Vapour Deposition

STS’ Plasma Enhanced Chemical Vapor Deposition (PECVD) process module is used to deposit an extensive selection of inorganic and organic, doped and undoped films for a wide range of applications in Photonics, Compound Semiconductors, MEMS and Advanced Packaging applications

PECVD uses a plasma to enhance the chemical reaction rates of the precursors, which allows deposition of thin films at lower temperatures (typically <350°C) than conventional chemical vapor deposition (CVD) systems, allowing use in III-V compound semiconductor device manufacture.

More info….

5. CVE Dry, plasma-less XeF2 etch

Surface Technology Systems and XACTIX, Inc. have jointly developed a new Chemical Vapor Etch (CVE) module for xenon difluoride (XeF₂) gas, with a breakthrough chamber design and improved wafer handling to ensure the high throughput, uniformity, efficiency and uptime required to make XeF₂ a viable etch process for high volume production.  

More info….

More info à  http://www.stsystems.com/index.asp?m=1