The EVG620 allows for imprint processes with stamps to substrates ranging from small chip size pieces up to 150 mm in diameter. Configurations for nanotechnology applications can include release mechanisms for stamps in addition to programmable high and low contact force. Uniform contact force for high yield large area printing is provided by EV Group's proprietary chuck design which supports both soft and hard stamps.

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The EVG6200 Infinity is the culmination of EV Group's new aligner-technology roadmap. A variety of stamps and substrates sizes from 75mm-to-200mm can be accommodated on the EVG6200 Infinity for nanoimprint lithography applications.

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The IQ Aligner UV-NIL System allows for micromolding and nanoimprinting processes with stamps and wafers from 150 mm to 300mm diameter. Uniform contact force for high yield large area printing is provided by EV Group's proprietary chuck design which supports both soft and hard stamps. Configurations include release mechanisms for stamps from imprinted substrates. 

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EV Group's EVG770 Automated NIL Stepper is designed for step and repeat large area UV-Nanoimprint Lithography (UV-NIL) processes compatible for 100 mm up to 300 mm wafers. The NIL Stepper covers applications like  life science, optical components, mastering, 3D-Lithography and R&D for semiconductor devices. 

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The EVG510HE Semi-automated Hot Embossing System is designed for embossing and nanoimprinting applications.  The hot embossing system is configured with a universal embossing chamber, high-vacuum and high-contact force capabilities and manages the whole range of polymers suitable for hot embossing. Together with high-aspect ratio embossing and multiple de-embossing options many processes for high quality pattern transfer and nm resolution are offered. 

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The EVG520HE Semi-automated Hot Embossing System is designed for embossing and nanoimprinting applications. This production-proven system from EVG accepts substrates up to 200 mm and is compatible with standard semiconductor manufacturing technologies. The hot embossing system is configured with a universal embossing chamber, high-vacuum and high-contact force capabilities and manages the whole range of polymers suitable for hot embossing. Together with high-aspect ratio embossing and multiple de-embossing options many processes for high quality pattern transfer and nm resolution are offered. More info…. 
 

The EVG750 is designed for high volume embossing and nanoimprinting applications of spin-on polymers as well as polymer substrates. It combines an alignment module, a high contact force imprinting module and a de-embossing station in a fully automated system targeting mainly microfluidic applications.

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More info-à  http://www.evgroup.com/en/products/lithography/nil_systems/