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Mask Aligment System
Mask Aligment System
Known for its high level of automation and reliability, the EVG620 is a dual-use tool designed for optical double-side lithography and precision alignment up to 150 mm wafer sizes. Volume production types and manual R&D systems are available. An ultra-soft wedge compensation together with a computer controlled contact force between the mask and wafer ensures that both yield and mask lifetime are dramatically increased while production costs are lowered. The fully-automated EVG620 utilizes a cassette-to-cassette handling system to efficiently process wafers from 50 mm to 150 mm in diameter, regardless of their shape or thickness. The system safely handles thick, bowed or small diameter wafers. The EVG620 superior alignment stage design achieves highly accurate alignment and exposure results while maintaining high throughput..
The EVG620NT Automated Mask Alignment System, which handles sizes of substrates starting from less than 5 mm up to 150 mm, offers new state-of-the-art features, including a granite base, active vibration isolation and linear motors to meet higher precision and throughput requirements. Built upon EV Group's most flexible and versatile aligner platforms, these new systems enable manufacturers to easily scale between R&D efforts to volume manufacturing in a simple one-to-one process transfer from manual mode to full automation. The ramp-up ease to volume manufacturing coupled with alignment accuracies improvements-down to 0.1 µm with insitu alignment verification-deliver significant cost-of-ownership (CoO) benefits
3- EVG®6200∞ Automated Mask Alignment System
The EVG6200 Infinity Alignment System is optimized for highest throughput, highest mean time between failures and most accurate print gap settings. It accommodates wafers and substrates up to 200 mm, varying in size, shape and thickness. Equipped with EV Group's new NanoAlign Technology, the EVG6200 Infinity improves competitiveness of full-field lithography by providing the industry´s highest alignment accuracy and resolution at lowest cost of ownership. With full field proximity exposure of very thick resist layers, the EVG6200 Infinity targets wafer bumping and chip scale packaging markets as well as applications in MEMS, Compound Semiconductor, Power Devices and Nanotechnology.
4- EVG®6200NT Automated Mask Alignment System
The EVG6200NT Automated Mask Alignment System, which handles sizes of substrates starting from 3 inches up to 200 mm, offers new state-of-the-art features, including a granite base, active vibration isolation and linear motors to meet higher precision and throughput requirements. Built upon EV Group's most flexible and versatile aligner platforms, these new systems enable manufacturers to easily scale between R&D efforts to volume manufacturing in a simple one-to-one process transfer from manual mode to full automation. The ramp-up ease to volume manufacturing coupled with alignment accuracies improvements-down to 0.1 µm with insitu alignment verification-deliver significant cost-of-ownership (CoO) benefits.
5- IQ Aligner® Automated Mask Alignment System
The IQ Aligner Automated Mask Alignment System is based on a field-proven, robust design with up to 300 mm wafer size capability, full-field exposure, single and double-side alignment, large gap and dark field mask alignment. The high automation level makes the IQ Aligner Automated Mask Alignment System suitable for volume production applications while tremendously lowering equipment operation and maintenance costs.
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