EPA - ElectroPlatingAutomatic
Electrochemical deposition in an automatic system
Pure metal and alloy deposition as Au, Ag, Cu, Sn, Ni, SnAg for different applications in semiconductor and microsystem technologies. Enhanced liquid flow and electrical field control ensure a homogenous deposition at highest plating rates.
RENA offers customised solutions for special applications.
Features and benefits:
- > 15 years experience in plating tools
- Modular design for maximum flexibility
- Edge exclusion < 3mm
- Convertible for 4“, 6“, 8“, 12“ or for special wafer geometries as rectangular substrates