Si DRIE (incl Pegasus and DSi)
Si DRIE (incl Pegasus and DSi)
SPTS’ market leading DRIE process modules are based on a decoupled, high density plasma source design. They are able to produce high concentrations of reactive fluorine atoms and polymer deposition pre-cursors, necessary for the chemical nature of the switched Bosch deep silicon etch process.
SPTS DRIE modules can also be used in a non-switched mode for tapered profiles, and in an RIE mode for simple dielectric etches. Delivering unparalleled process capability with world-class productivity & CoO metrics, the SPTS DRIE process modules are used in a wide variety of applications across the following markets, such as: